The ongoing program to develop a custom hybrid pixel detector for the innermost layers of the tracking system of the PANDA experiment foresees thinned epitaxial silicon sensors and pixel readout electronics based on 130 nm CMOS technology. The displacement damage test with neutron from the nuclear reactor has been performed on some test structures, characterized by high resistivity epitaxial silicon material, showing annealing effects. Besides, the second reduced scale prototype for the pixel readout has been designed and tested. Results concerning study of epitaxial silicon devices and characterization of chip using time-over-threshold (TOT) approach will be presented.
Hybrid pixel detector with epitaxial sensors and readout in 130 nm CMOS technology for PANDA
KUGATHASAN, THANUSHAN;
2010-01-01
Abstract
The ongoing program to develop a custom hybrid pixel detector for the innermost layers of the tracking system of the PANDA experiment foresees thinned epitaxial silicon sensors and pixel readout electronics based on 130 nm CMOS technology. The displacement damage test with neutron from the nuclear reactor has been performed on some test structures, characterized by high resistivity epitaxial silicon material, showing annealing effects. Besides, the second reduced scale prototype for the pixel readout has been designed and tested. Results concerning study of epitaxial silicon devices and characterization of chip using time-over-threshold (TOT) approach will be presented.I documenti in IRIS sono protetti da copyright e tutti i diritti sono riservati, salvo diversa indicazione.